This upcoming batch of OSPi 1.4 largely follows the prototype seen here:
Because Maker Faire is coming soon, I didn’t have time to introduce new features, so this batch has the same hardware features as 1.3, except 1) it uses the injection molded enclosure, and 2) a microSD to low-profile SD adapter will be included in the kit.
The hole is currently covered by a sticker. I’ve also ordered laser cut acrylic pieces which can be glued from the back of the hole. That works pretty well and there are different colors I can choose. Hopefully the acrylic covers will be ready by Maker Faire time.